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MAX2022 Evaluation Kit
C = 15pF
C = 10pF
100 ?
MAX2022
I
C = 10pF
L = 15nH
100 ?
C = 15pF
RF MODULATOR
C = 10pF
C = 15pF
LO
0 °
90 °
∑
100 ?
Q
L = 15nH
C = 15pF
C = 10pF
100 ?
Figure 1. Diplexer Network
Layout Considerations
The MAX2022 evaluation board can be a guide for your
board layout. Pay close attention to thermal design and
close placement of components to the IC. The
MAX2022’s package exposed paddle (EP) conducts
heat from the device and provides a low-impedance
electrical connection to the ground plane. The EP must
be attached to the PCB ground plane with a low ther-
mal and electrical impedance contact. Ideally, this is
achieved by soldering the backside of the package
directly to a top metal ground plane on the PCB.
Alternatively, the EP can be connected to an internal or
bottom-side ground plane using an array of plated vias
directly below the EP. The MAX2022 EV kit uses nine
evenly spaced 0.016in-diameter, plated through holes
to connect the EP to the lower ground planes.
Depending on the ground plane spacing, large sur-
face-mount pads in the IF path may need to have the
ground plane relieved under them to reduce parasitic
shunt capacitance.
4
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MAX2023ETX-T 功能描述:调节器/解调器 1.5GHz-2.3GHz Quad Mod/Demod RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel
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